I have a Microcenter Powerspec i3 plus running the ADVi3++ firmware. I’ve done some modifications to it; have a glass bed (using hair spray), z-brace, bltouch, diicooler, and have run through the extruder calibration process. For this test, I’m using Inland White PLA and printing from an sd card. I’m using Simplify 3D for my slicer and have adjusted the temperatures of the layers in the temperature process settings in S3D. I also verified on the touch screen of the printer that the temperatures were actually printing properly through the making of the tower. I also adjusted the extrusion multiplier in the slicer from measuring block walls I recently printed.
In my slicer, I have the following setup. Truth be told, I copied these from somebody else and now trying to tweak it to my setup. The only thing I adjusted was the extrusion multiplier:
Nozzle Diameter: .4mm
Extrusion Multipler: .78
Extrusion Width: .40mm
Retraction Distance: 4.5mm
Extra Restart Distance: 0mm
Retraction Vertical Lift: 1.0
Retraction Speed: 2400 mm/min
Coasting Distance: 0.8mm
Coast at End: Checked
Bed Temperature: 60*
Extruder Temperature: 215*
Fan: 0% for first layer, 100% after that
Default Print Speed: 3600 mm/min
Outline underspeed: 50%
solid infill underspeed: 80%
Support Structure Underspeed: 80%
X/Y Axis Movement Speed: 6000 mm/min
Z Axis Movement Speed: 1002 mm/min
Adjust printing speed for layers below: 15.0 sec
Allow speed reductions down to 20%
Now that I’ve printed the tower, I don’t think it’s bad but I don’t think it’s great either. I’m not exactly sure where to go from here. To me, the tower looks OK all around, except for the hanging filament on the bridge part. If I were to guess, maybe 220 looks the best? But to me, they look all about the same.
The second is a stringing test and I think it looks OK but also think maybe it can be a bit better too. In this particular example, I’m printing at 215*.
Any suggestions on where to go from here would be appreciated.